S900 Pro  [ PCleGen5.0 ]

S900 Pro uses the PCleGen5.0 x4 master controller Phison PS5026-E26 and the new generation of 232-layer 3D TLC NAND flash memory. S900 Pro provides breakthrough flagship performance, bringing faster data transfer and lower latency gaming experience to PC enthusiasts, e-sports players and rendering professionals.

·The new heat sink fin armor uses a composite surface aluminum die-casting process for efficient heat dissipation. Under high load conditions, the reading rate can still be close to the peak value;

·Micron's sixth-generation 3D NAND flash memory (B58R) has 232 layers of stacked flash memory technology (2400MT/s), which has increased the number of stacked layers by 32% compared to the previous generation, and the package size has been reduced by 28%;

·Support TRIM & S.M.A.RT, AES-256 encryption, advanced wear leveling, adaptive thermal protection function, power saving management, and reserved space technology;

·5th generation LDPC error correction mechanism; ·Original particles are used to ensure that each read and write can be smooth and fast, and dynamic SLC cache is configured with up to 4GB* of LPDDR4 DRAM. It can achieve fast and stable high-frequency data access, which helps to extend the life of TLC particles;